Cypress Semiconductor CY8C24423A Dokumentacja Pobierz pdf (Strona 36)

CY8C24223A, CY8C24423A

Document Number: 001-52469 Rev. *H Page 36 of 50

Packaging Information

This section illustrates the packaging specifications for the automotive CY8C24x23A PSoC device, along with the thermal impedances

for the package and the typical package capacitance on crystal pins.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the emulator pod drawings at http://www.cypress.com.

Packaging Dimensions

Figure 14. 20-Pin (210-Mil) SSOP

51-85077 *E

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Cypress Semiconductor CY8C24423A Dokumentacja Strona 36