
PRELIMINARY
CY7C1380C
CY7C1382C
Document #: 38-05237 Rev. *B Page 6 of 28
Pin Definitions
Name I/O Description
A0
A1
A
Input-
Synchronous
Address Inputs used to select one of the address locations. Sampled at the rising edge
of the CLK if ADSP
or ADSC is active LOW, and CE
1,
CE
2
, and
CE
3
are sampled active. A
[1:0]
feed the two-bit counter.
BWa
BWb
BWc
BWd
Input-
Synchronous
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the
SRAM. Sampled on the rising edge of CLK.
GW Input-
Synchronous
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a
global write is conducted (ALL bytes are written, regardless of the values on BW
a,b,c,d
and
BWE
).
BWE Input-
Synchronous
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must
be asserted LOW to conduct a byte write.
CLK Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. Also used to increment
the burst counter when ADV
is asserted LOW, during a burst operation.
CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
2
and CE
3
to select/deselect the device. ADSP is ignored if CE
1
is HIGH.
CE
2
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and CE
3
to select/deselect the device. (TQFP Only)
CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction
with CE
1
and
CE
2
to select/deselect the device. (TQFP Only)
OE Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins.
When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are
three-stated, and act as input data pins. OE
is masked during the first clock of a read cycle
when emerging from a deselected state.
ADV Input-
Synchronous
Advance Input signal, sampled on the rising edge of CLK. When asserted, it automatically
increments the address in a burst cycle.
ADSP Input-
Synchronous
Address Strobe from Processor, sampled on the rising edge of CLK. When asserted
LOW, A is captured in the address registers. A
[1:0]
are also loaded into the burst counter. When
ADSP
and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE
1
is
deasserted HIGH.
ADSC Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of CLK. When asserted
LOW, A
[x:0]
is captured in the address registers. A
[1:0]
are also loaded into the burst counter.
When ADSP and ADSC are both asserted, only ADSP is recognized.
MODE Input Pin Selects Burst Order. When tied to GND selects linear burst sequence. When tied to V
DDQ
or left floating selects interleaved burst sequence. This is a strap pin and should remain static
during device operation.
ZZ Input-
Asynchronous
ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep”
condition with data integrity preserved.
DQa, DPa
DQb, DPb
DQc, DPc
DQd, DPd
I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by A
X
during the previous clock rise of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH, DQx
and DPx
are placed in a three-state condition. DQ a,b,c and d are 8 bits wide. DP a,b,c and
d are 1 bit wide.
TDO JTAG serial output
Synchronous
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. (BGA and
FBGA Only)
TDI JTAG serial input
Synchronous
Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK.(BGA and FBGA Only)
TMS Test Mode Select
Synchronous
This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK.
(BGA and FBGA Only)
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