Cypress Semiconductor STK16C88 Instrukcja Użytkownika Strona 26

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12.02.07
26
Simtek Confidential
nvSRAM vs Battery Backed SRAMs
More difficult to manufacture due to:
Can’t flow solder directly. Requires
two solder flows
Requires a socket for single solder
flow process
Yield loss due to insertion process
Requires hand insertion into the
socket, requiring a secondary step just
to deal with the battery
Even with snaphat package, this
requires a secondary step for addition
of the battery.
More inventory of components
Need to track shelf life of battery
Batteries have hazardous waste
material
No specialized write procedures, easy
on F/W
BBSRAMs
Higher manufacturing yield and capacity due
to:
Single solder flow assembly.
No insertion or secondary steps
No hand or manual placement
Manufacturing
No hazardous materialROHS
No specialized write procedures, easy on
F/W
No need to gauge battery life and develop
scheme for data recovery after power loss
Hardware and
firmware
design
Category nvSRAMs
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