Cypress Semiconductor CY7C64013C Podręcznik Użytkownika Pobierz pdf (Strona 46)

CY7C63722C

CY7C63723C

CY7C63743C

FOR

Document #: 38-08022 Rev. *C Page 45 of 49

27.0 Ordering Information

Ordering Code EPROM

Size

Package

Name

Package Type Operating

Range

CY7C63723C-PXC 8 KB P3 18-Pin (300-Mil) Lead-free PDIP Commercial

CY7C63723C-SXC 8 KB S3 18-Pin Small Outline Lead-free Package Commercial

CY7C63743C-PXC 8 KB P13 24-Pin (300-Mil) Lead-free PDIP Commercial

CY7C63743C-SXC 8 KB S13 24-Pin Small Outline Lead-free Package Commercial

CY7C63743C-QXC 8 KB Q13 24-lead QSOP Lead-free Package Commercial

CY7C63722C-XC 8 KB – 25-Pad DIE Form Commercial

28.0 Package Diagrams

51-85010-*A

18-Lead (300-Mil) Molded DIP P3

51-85023-A

PIN 1 ID

SEATING PLANE

0.447[11.353]

0.463[11.760]

18 Lead (300 Mil) SOIC - S3

10 18

DIMENSIONS IN INCHES[MM]

MIN.

MAX.

0.291[7.391]

0.300[7.620]

0.394[10.007]

0.419[10.642]

0.050[1.270]

TYP.

0.092[2.336]

0.105[2.667]

0.004[0.101]

0.0118[0.299]

0.0091[0.231]

0.0125[0.317]

0.015[0.381]

0.050[1.270]

0.013[0.330]

0.019[0.482]

0.026[0.660]

0.032[0.812]

0.004[0.101]

REFERENCE JEDEC MO-119

PART #

S18.3 STANDARD PKG.

SZ18.3 LEAD FREE PKG.

18-Lead (300-Mil) Molded SOIC S3

51-85023-*B

1 2 ... 41 42 43 44 45 46 47 48 49 50

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